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Solder wire ISO-Core® RA Sn96Ag04Cu0.7
(Product No.: FE-18841030)
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Solder wire ISO-Core® RA Sn96Ag04Cu0.7

dpvlink:
15245
Form:
Reel
Weight [g]:
500
Note:
- Further diameters/reel sizes available on request -
Further product information
 

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Product Info
Solder Wire ISO-Core® RA Sn96Ag04Cu0.7 The solder wire ISO-Core® RA Sn95.5Ag3.8Cu0.7 is a high-quality, lead-free alloy specifically developed for manual and automatic soldering in electronics, electrical engineering, and electromechanics. It features a eutectic melting temperature of 217°C and enables optimal wetting as well as excellent spreading properties. The flux composition is mildly halogen activated with a content of 2.5% according to DIN EN 29454, 1.1.2.B (EN 61190-ROM1), which leads to splash-free and crystal-clear residues that are thermally stable and do not cause corrosion on non-ferrous metals. This makes the solder wire also suitable for demanding applications where residues can remain on the solder joints. Technical Data: - Alloy: Sn95.5Ag3.8Cu0.7 - Melting point: 217°C, eutectic - Flux content: 2.5% - Flux type: DIN EN 29454, 1.1.2.B (EN 61190-ROM1) - Form: Spool - Weight: 500g - Diameter: 1.0 mm Item number: FE-18841030. Available in various diameters and spool sizes upon request.
Form
Form
Reel
Weight [g]
Weight [g]
500
Melting point
Melting point
217
- Further diameters/reel sizes available on request -
Common

ISO-Core® for fine soldering in the electronics and electrical engineering as well as in the telecommunications and electric motor construction.
FELDER ISO-Core® soldering wires are made of the same high-purity alloy components according to the international standards as FELDER ISO-Tin® electronic solders.



ProductAlloyMelting rangeApplication
Sn100Ni+® **Sn99.3Cu0.7AgNiGe227 °C eutecticManual and mechanical soldering, lead-free
Sn99Ag+® **Sn99Ag0.3Cu0.7NiGe217 °C - 227 °CManual and mechanical soldering, lead-free
SAC Sn95.5Ag3.8Cu0.7217 °C eutecticManual and mechanical soldering, lead-free
 Sn96.5Ag3.5  Sn96.5Ag3.5 221 °C eutecticManual and mechanical soldering, lead-free
Sn99.3Cu0.7Sn99.3Cu0.7227 °C eutecticManual and mechanical soldering, lead-free
Sn97Cu3Sn97Cu3230 °C - 250 °CManual and mechanical soldering, lead-free
Sn60Pb40Sn60Pb40183 ºC - 190 °CManual and mechanical soldering, leaded
Sn63Pb37Sn63Pb37183 °C eutecticManual and mechanical soldering, leaded
Sn60Pb38Cu2Sn60Pb38Cu2183 ºC - 190 °CManual and mechanical soldering, leaded


** Fuji patent: DE Patent no. 19816671C2; US Patent no. 6.179.935B1; Japan Patent no. 3296289

Further alloys available on request



The flux is characterized by its high temperature resistance. The bright solid flux residues of this soldering wires do not cause corrosion in non-ferrous metals. They can therefore remain on the solder joint. An optimum wetting and spreading values exceeding the normal standards turn it into a top product in flux-cored solder wires, also in its lead-free quality.

In combination with the lead-free alloy Sn95.5Ag3.8Cu0.7, the qualities of "EL" and "ELR" were assessed positively by Siemens Berlin (certification authority CT MM 6).



Halogen-activated flux

Flux-cored, halogen-activated soft solder wires
Flux according to DIN EN 29454.1, 1.1.2.B, or
DIN EN 61190-1-3, ROM1

ISO-core® "RA"Standard solder wire for manual soldering in the electronics, halogen content < 1%



No.-clean flux low halogen 

Flux-cored, low activated, lead-free soft solder wires
Splash-free, clear residue, thermally stable, optimal wetting
Flux according to DIN EN 29454.1, 1.2.2.B, or  DIN EN 91190-1-3, REL1

ISO-core® "Clear"

Splash-free solder wire for manual and
automatic soldering in electronics, electrical engineering

and electromechanical engineering, standard flux content 3.5%



No-clean flux halogen-free

Flux-cored, halogen-free activated soft solder wires
Flux according to DIN EN 29454.1, 1.1.3.B, 1.2.3.B, and 2.2.3.B or
DIN EN 61190-1-3
ISO-core® "EL"No-clean standard solder wire for manual and
automatic soldering in the electronics, halogen-free activated(1.1.3.B/ROL0), standard flux content 3.5%
ISO-core® "ELR"Low-residue no-clean SMD solder wire.
Specially adapted to the requirements of
resoldering work on SMD-equipped components
(2.2.3.B/ORL0), standard flux content 1%

Solder wires are available with diameters Ø 0,15 mm, 0.25 mm, 0.50 mm, 0.75 mm, 1 mm, 1.5 mm, 2 mm, 3 mm, 4 mm.
Reel sizes: 100 g, 250 g, 500 g, 1000 g, 2500 g, 5000 g
Flux distribution: single-cored (standard), 2- and 5-cored on request

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Article descriptionArticle imageFormWeight [g]PriceCompare
FE-18841030
Solder wire ISO-Core® RA Sn96Ag04Cu0.7 		FE-18841030 - Solder wire ISO-Core® RA Sn96Ag04Cu0.7 Reel500 -
FE-18840520
Solder wire ISO-Core® RA Sn96Ag04Cu0.7 		FE-18840520 - Solder wire ISO-Core® RA Sn96Ag04Cu0.7 Reel250 -
FE-18840730
Solder wire ISO-Core® RA Sn96Ag04Cu0.7 		FE-18840730 - Solder wire ISO-Core® RA Sn96Ag04Cu0.7 Reel500 -
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