The "Ti" blade wave pair from CAB, equipped with 16 precision-ground roller knives and specially adapted spacer rings, is specifically designed for separating circuit boards with up to 8 scoring grooves. This high-quality tool enables almost tension-free separation of the circuit boards, with the board thickness varying between 1.0 and 3.2 mm. The remaining thickness after separation is a minimum of 0.30 mm and a maximum of 0.60 mm, while the scoring depth reaches at least 0.30 mm.
The MAESTRO 5L depanelizer, which integrates the blade wave pair, supports a maximum panel width of 310 mm and can process circuit board widths from 10 to 290 mm. The separation speed is adjustable in 10 steps from 100 to 220 mm/s, and the separation length varies between 100 and 570 mm, depending on the activation of the light barrier. The component height can be up to 30 mm on the assembly side and up to 10 mm on the solder side.
In addition to high precision and adaptability, the MAESTRO 5L is known for its user-friendliness and safety. It features a SMEMA interface for seamless integration into assembly lines and an optional automatic feeder. The safety standards comply with EC directives, and an EC declaration of conformity is included.
Included in the delivery are the MAESTRO 5L base, the required number of roller knives, supports, and handle grips, as well as an adjustment device for changing the knives. This system thus represents a comprehensive solution for precise and safe separation of circuit boards in industrial applications.
Details
- Groove number
Groove number
- 8
- Numbers of blades
Numbers of blades
- 16