Soldering technology

Soldering technology

As a specialist in equipping EPA protection zones in electronics manufacturing, we understand your needs and offer a wide range of soldering technology designed specifically to meet the needs of the electronics industry. Soldering technology, as the most common methodology in electrostatic connection technology today, plays a decisive role in the manufacture of electronic circuits and devices. To ensure the highest quality and reliability, it is essential to use first-class soldering tools and materials.

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Easy-click-60 articulated extraction arm
with stop valve and ball joint clamp
(without accessories)

Product No.: FT-3446
276.79 CHF
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Easy-click-60 articulated double extraction arm
ESD-safe with shut-off valve and table clamp set
(without accessories)

Product No.: FT-4402
512.69 CHF
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Z Adapter ESD
for mounting suction nozzles with
quick adapter 60 mm on fixed extraction arms

Product No.: FT-Z
63.34 CHF
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Zero Smog Shield Pro replacement silicone mat

Product No.: FT91000045
Price on request
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Electronics solder ISO-TIN "Sn96Ag +"
Sn96, 5Ag3, 0Cu0, 5NiGe according to
Fuji-Pat-No. DE 19816671C 2
approx. 400 g bars

Product No.: FE-5512761026
Price on request
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Solder bars ISO-Tin Sn96Ag+
Melting point: 217 - 227 / Form: Bars / Weight [g]: approx. 250
Electronics solder FELDER "Sn99Ag +" bars
Sn99Ag0,3CuNiGe according to
Fuji-Pat-No. DE 19816671C2
approx. 400 g bars, 20 kg cartons

Product No.: FE-5512811026
Price on request
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Solder bars ISO-Tin S-Sn99Cu1
Melting point: 227 / Form: Triangular bars / Weight [g]: approx. 250
FELDER electronics solder ISO Tin S-Sn99Cu1
DIN EN 29453 (Sn99.75.3Cu0.7 - eutectic)
Triangular bars, approx. 250 g, 20 kg cartons

Product No.: FE-12940120
Price on request
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FELDER solder bars ISO-Tin® Sn100Ni+
Melting point: 227 / Form: Bars / Weight [g]: approx. 250
FELDER electronics solder ISO Tin "Sn99.3CuNiGe"
according to Fuji-Pat-No. DE 19816671C2
approx. 400 g bars, 20 kg cartons

Product No.: FE-5512941026
Price on request
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FELDER Solder bar Sn100C
Melting point: 227 / Form: Bars / Weight [g]: approx. 1000g
Electronics solder Felder "SN100C"
Sn99,3CuNiGe0,0055
melting point 227°C
according to NIHON-SUPERIOR-Pat.No. EP 0985486B1
bars, ca. 1000g, 330 x 20 x 20 mm

Product No.: FE-5612940040
Price on request
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Solder wire ISO-Core® RA Sn100Ni+
Form: Reel / Weight [g]: 250
Solder wire ISO-core "RA", Sn100Ni + 0.5 mm, 250 g
Sn99. 3CuNiGe
according to Fuji-Pat-No. DE19816671C2, 2.5% flux
part according to DIN EN 29454, 1.1.2.B
(EN61190-ROM1)

Product No.: FE-5518940520
Price on request
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Product No.: FE-5518940730
Price on request
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Solder wire ISO-Core® RA Sn100Ni+
Form: Reel / Weight [g]: 500
Solder wire ISO-core 'RA' Sn100Ni+,Sn99.3Cu0.7NiGe
After Fuji-Pat.-No.. DE 19816671C 2, 2.5%
Flux content according to DIN EN 29454, 1.1.2.B
(EN61190-ROM1) 1.00 mm diameter, 0.500 g reel

Product No.: FE-5518941030
Price on request
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Solder wire ISO-Core® RA Sn96Ag04Cu0.7
Form: Reel / Weight [g]: 250
Solder wire ISO-Core "RA" Sn95.5Ag3.8Cu0.7
LEAD-FREE SPECIAL ALLOY
2.5% flux content according to DIN EN 29454,.
1.1.2.B (EN 61190-ROM1)
0.5 mm, 500 g

Product No.: FE-18840520
Price on request
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Solder wire ISO-Core® RA Sn96Ag04Cu0.7
Form: Reel / Weight [g]: 500
Solder wire ISO-Core "RA" Sn95.5Ag3.8Cu0.7
LEAD-FREE SPECIAL ALLOY
2.5% flux content according to DIN EN 29454,.
1.1.2.B (EN 61190-ROM1)
0.75 mm, 500 g

Product No.: FE-18840730
Price on request
1153 to 1168 (from a total of 1224)