Solder pastes FELDER
![Solder pastes FELDER Solder pastes FELDER](images/categories/6845.jpg)
ISO-Cream® SMD FELDER solder pastes ensure a high flexibility.
All ISO-Cream® SMD solder pastes can be adjusted with viscosities between 300 and 900 PA s (according to Brookfield, 5 U/min, TF spindle, 25 °C) according to customer's demand. Advanced testing and control procedures based on national and international standards guarantee 100% continuous, batch-to-batch qualities.
No-clean SMD soft solder pastes
Homogeneous, ready-made and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics. | |
ISO-Cream® "EL 5510" | No-clean SMD solder paste, best wetting in lead-free applications. Premium contour stability, optimal printability, very high surface resistance. Long processing period of at least 48 hours. Suitable for all reflow applications. (ROL0) |
ISO-Cream® "Clear" | No-clean SMD solder paste, best wedding on all PCB surfaces especially NiAu and NiPd unter normal conditions. Ptotective atmosphere also in the vapor phase, halogene-fre (<0.01%), rosin-free, clear and unobtrusive residues, low tendency to void generation |
ISO-Cream® "EL 3202" | No-clean SMD solder paste, best suitability for vapor phase soldering. Particularly suited for the stencil printing. Low water-clear residues. Long processing period of at least 48 hours. (ROL1) |
ISO-Cream® "EL 3203" | No-clean SMD solder paste with excellent wet bonding strength for automatic placement machines with high acceleration or deceleration. Printed circuit boards up to 32 h can be equipped. High contour stability, high service life on the stencil (up to 8 hours). (ROL1) |
SMD special soft soldering pastes
For soldering of poorly solderable components with downstream cleaning process. Homogeneous, ready to use and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics. | |
ISO-Cream® "RA 2601" | Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ROM1. Especially for poorly wettable solder partner. The flux residues on the soldered circuits should be removed. |
ISO-Cream® "ELW 2303" | Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ORM0. Solder paste with water soluble residues. Excellent wetting on all common surfaces. The residues can be completely removed with distilled water. |
Cans | 250 g und 500 g |
Cartridges | 6 und 12 oz Semco® |
Cartridges | ProFlow™ and PuckPack™ |
Dispenser cartridge | 5, 10 und 30 ccm |
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Sn96Ag+® Sn96.5Ag3Cu0.5NiGe | 217 - 219 ºC |
Sn100Ni+® Sn99.3Cu0.7AgNiGe | 227 ºC eutectic |
Sn95.5Ag4Cu0.5 | 217 ºC eutectic |
Sn96.5Ag3.5 | 221 ºC eutectic |
Bi58Sn42 | 138 ºC eutectic |
Leaded Alloys | |
Sn62Pb36Ag2 | 179 ºC eutectic |
Sn63Pb37 | 183 ºC eutectic |
Pb93Sn5Ag2 | 296 - 301 ºC |
Metal proportions | |
Dispenser application | 85 - 88 % |
Screen printing | 88 % |
Stencil printing | 88 - 90 % |
Grain sizes | ||
KG 2 | Standard | 45 - 75 µm |
KG 3 | Fine-Pitch | 25 - 45 µm |
KG 4 | Superfine-Pitch | 20 - 38 µm |
KG 5 | Superfine-Pitch | 15 - 25 µm |
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