Solder paste ISO-Cream EL3202 500g
Solder Paste ISO-Cream EL3202 500g
ISO-Cream® EL3202 is a high-quality SMD solder paste from Felder, specifically developed for demanding lead-free applications. This paste is characterized by its first-class contour stability and optimal printing properties. It offers excellent wetting and is particularly suitable for stencil printing and vapor phase soldering. The paste leaves minimal, water-clear residues and remains stable over a long processing period of at least 48 hours. ISO-Cream® EL3202 is halogen-free (<0.01%) and rosin-free, leading to clear, inconspicuous residues and minimizing the tendency for void formation. Suitable for all reflow applications, it meets the requirements of the ROL1 classification.
Technical Details:
- Content: 500g
- Metal content: 90%
- Particle size: 3 (25-45 µm)
- Alloy: Sn95.5Ag4Cu0.5
- Melting point: 217 °C eutectic
- Viscosity: Adjustable between 300 and 900 Pa s (Brookfield, 5 rpm, TF spindle, 25 °C)
ISO-Cream® EL3202 offers a reliable solution for high-quality solder joints in electronics manufacturing.
Item number: FE-238432029060
Details
- Content [g] Content [g]
- 500
- Metal content [%] Metal content [%]
- 90
- Grain size Grain size
- 3 (25-45 µm)
- Melting point Melting point
- 217
No-clean SMD soft solder pastes
| Homogeneous, ready-made and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics. | |
| ISO-Cream® "EL 5510" | No-clean SMD solder paste, best wetting in lead-free applications. Premium contour stability, optimal printability, very high surface resistance. Long processing period of at least 48 hours. Suitable for all reflow applications. (ROL0) |
| ISO-Cream® "Clear" | No-clean SMD solder paste, best wedding on all PCB surfaces especially NiAu and NiPd unter normal conditions. Ptotective atmosphere also in the vapor phase, halogene-fre (<0.01%), rosin-free, clear and unobtrusive residues, low tendency to void generation |
| ISO-Cream® "EL 3202" | No-clean SMD solder paste, best suitability for vapor phase soldering. Particularly suited for the stencil printing. Low water-clear residues. Long processing period of at least 48 hours. (ROL1) |
| ISO-Cream® "EL 3203" | No-clean SMD solder paste with excellent wet bonding strength for automatic placement machines with high acceleration or deceleration. Printed circuit boards up to 32 h can be equipped. High contour stability, high service life on the stencil (up to 8 hours). (ROL1) |
SMD special soft soldering pastes
For soldering of poorly solderable components with downstream cleaning process. Homogeneous, ready to use and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics. | |
| ISO-Cream® "RA 2601" | Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ROM1. Especially for poorly wettable solder partner. The flux residues on the soldered circuits should be removed. |
| ISO-Cream® "ELW 2303" | Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ORM0. Solder paste with water soluble residues. Excellent wetting on all common surfaces. The residues can be completely removed with distilled water. |
| Cans | 250 g und 500 g |
| Cartridges | 6 und 12 oz Semco® |
| Cartridges | ProFlow™ and PuckPack™ |
| Dispenser cartridge | 5, 10 und 30 ccm |
 Alloys | |
| Sn96Ag+® Sn96.5Ag3Cu0.5NiGe | 217 - 219 ºC |
| Sn100Ni+® Sn99.3Cu0.7AgNiGe | 227 ºC eutectic |
| Sn95.5Ag4Cu0.5 | 217 ºC eutectic |
| Sn96.5Ag3.5 | 221 ºC eutectic |
| Bi58Sn42 | 138 ºC eutectic |
| Leaded Alloys | |
| Sn62Pb36Ag2 | 179 ºC eutectic |
| Sn63Pb37 | 183 ºC eutectic |
| Pb93Sn5Ag2 | 296 - 301 ºC |
| Metal proportions | |
| Dispenser application | 85 - 88 % |
| Screen printing | 88 % |
| Stencil printing | 88 - 90 % |
| Grain sizes | ||
| KG 2 | Standard | 45 - 75 µm |
| KG 3 | Fine-Pitch | 25 - 45 µm |
| KG 4 | Superfine-Pitch | 20 - 38 µm |
| KG 5 | Superfine-Pitch | 15 - 25 µm |
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