Solder paste ISO-Cream EWL 250g
Solder Paste ISO-Cream EWL 250g
The ISO-Cream® EWL 250g solder paste from Felder offers an optimal solution for high-precision soldering applications. This no-clean SMD solder paste is characterized by a homogeneous, low-odor mixture of metal powder, binders, solvents, flux, and thixotropic agents. Specifically developed for applications requiring excellent wetting and minimal residues, it is ideal for use on all common printed circuit board surfaces, including NiAu and NiPd. The paste is halogen-free (<0.01%) and rosin-free, ensuring clear, inconspicuous residues and reducing the tendency for void formation. Technical Data: - Content: 250 g - Metal content: 89% - Particle size: 3 (25-45 µm) - Alloy: Sn95.5Ag4Cu0.5, lead-free - Melting point: 217 °C eutectic - Viscosity: Adjustable between 300 and 900 Pa s (according to Brookfield, 5 RPM, TF spindle, 25 °C) - Processing time: At least 48 hours - Suitable for all reflow applications The ISO-Cream® EWL 250g solder paste meets the highest quality standards, supported by state-of-the-art testing and control procedures according to national and international standards, to ensure continuous, batch-to-batch quality. Ideal for technical buyers who value precision and reliability.
Item number: FE-238423038955
The ISO-Cream® EWL 250g solder paste from Felder offers an optimal solution for high-precision soldering applications. This no-clean SMD solder paste is characterized by a homogeneous, low-odor mixture of metal powder, binders, solvents, flux, and thixotropic agents. Specifically developed for applications requiring excellent wetting and minimal residues, it is ideal for use on all common printed circuit board surfaces, including NiAu and NiPd. The paste is halogen-free (<0.01%) and rosin-free, ensuring clear, inconspicuous residues and reducing the tendency for void formation. Technical Data: - Content: 250 g - Metal content: 89% - Particle size: 3 (25-45 µm) - Alloy: Sn95.5Ag4Cu0.5, lead-free - Melting point: 217 °C eutectic - Viscosity: Adjustable between 300 and 900 Pa s (according to Brookfield, 5 RPM, TF spindle, 25 °C) - Processing time: At least 48 hours - Suitable for all reflow applications The ISO-Cream® EWL 250g solder paste meets the highest quality standards, supported by state-of-the-art testing and control procedures according to national and international standards, to ensure continuous, batch-to-batch quality. Ideal for technical buyers who value precision and reliability.
Item number: FE-238423038955
Details
- Content [g] Content [g]
- 250
- Metal content [%] Metal content [%]
- 89
- Grain size Grain size
- 3 (25-45 µm)
- Melting point Melting point
- 217
No-clean SMD soft solder pastes
| Homogeneous, ready-made and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics. | |
| ISO-Cream® "EL 5510" | No-clean SMD solder paste, best wetting in lead-free applications. Premium contour stability, optimal printability, very high surface resistance. Long processing period of at least 48 hours. Suitable for all reflow applications. (ROL0) |
| ISO-Cream® "Clear" | No-clean SMD solder paste, best wedding on all PCB surfaces especially NiAu and NiPd unter normal conditions. Ptotective atmosphere also in the vapor phase, halogene-fre (<0.01%), rosin-free, clear and unobtrusive residues, low tendency to void generation |
| ISO-Cream® "EL 3202" | No-clean SMD solder paste, best suitability for vapor phase soldering. Particularly suited for the stencil printing. Low water-clear residues. Long processing period of at least 48 hours. (ROL1) |
| ISO-Cream® "EL 3203" | No-clean SMD solder paste with excellent wet bonding strength for automatic placement machines with high acceleration or deceleration. Printed circuit boards up to 32 h can be equipped. High contour stability, high service life on the stencil (up to 8 hours). (ROL1) |
SMD special soft soldering pastes
For soldering of poorly solderable components with downstream cleaning process. Homogeneous, ready to use and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics. | |
| ISO-Cream® "RA 2601" | Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ROM1. Especially for poorly wettable solder partner. The flux residues on the soldered circuits should be removed. |
| ISO-Cream® "ELW 2303" | Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ORM0. Solder paste with water soluble residues. Excellent wetting on all common surfaces. The residues can be completely removed with distilled water. |
| Cans | 250 g und 500 g |
| Cartridges | 6 und 12 oz Semco® |
| Cartridges | ProFlow™ and PuckPack™ |
| Dispenser cartridge | 5, 10 und 30 ccm |
 Alloys | |
| Sn96Ag+® Sn96.5Ag3Cu0.5NiGe | 217 - 219 ºC |
| Sn100Ni+® Sn99.3Cu0.7AgNiGe | 227 ºC eutectic |
| Sn95.5Ag4Cu0.5 | 217 ºC eutectic |
| Sn96.5Ag3.5 | 221 ºC eutectic |
| Bi58Sn42 | 138 ºC eutectic |
| Leaded Alloys | |
| Sn62Pb36Ag2 | 179 ºC eutectic |
| Sn63Pb37 | 183 ºC eutectic |
| Pb93Sn5Ag2 | 296 - 301 ºC |
| Metal proportions | |
| Dispenser application | 85 - 88 % |
| Screen printing | 88 % |
| Stencil printing | 88 - 90 % |
| Grain sizes | ||
| KG 2 | Standard | 45 - 75 µm |
| KG 3 | Fine-Pitch | 25 - 45 µm |
| KG 4 | Superfine-Pitch | 20 - 38 µm |
| KG 5 | Superfine-Pitch | 15 - 25 µm |
GHS05
Substances and mixtures that have a corrosive, skin-corrosive and/or severely eye-damaging effect on metals (acids, alkalis)
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