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Solder pastes FELDER

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Solder paste ISO-Cream "Clear"
Content : 500 g / Metal content [%]: 88.5 % / Grain size: 3 (25-45 µm)
Solder paste ISO-cream "Clear" Sn96,5Ag3,0Cu0,5
LEAD-FREE. (REL0)
Melting point: 217° - 219°C
Metal powder part 88.5%, particle size 3,
500g can

Product No.: FE-238552008960
Price on request
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Solder paste ISO-Cream EL3202 500g
Content : 500 g / Metal content [%]: 90 % / Grain size: 3 (25-45 µm)
Solder paste ISO-Cream "EL-3202" Sn95.5Ag4Cu0.5
Lead-free, flux DIN EN 29454, 2.1.3.C
Metal powder content 89%, particle size 3
melting point 217° C eutectic, 250 g can
(EN 61190-ROL1)

Product No.: FE-238432029060
Price on request
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Solder paste ISO-Cream EL5510 500g
Content : 500 g / Metal content [%]: 88 - 89 % / Grain size: 3 (25-45 µm)
Solder paste ISO-Cream "EL 5510" S Sn96Ag +
(Sn96.5Ag3.0Cu0.5NiGe), flux DIN EN 29454
1.1.3.C (EN61190 ROL0)
Metal powder content 88-89%, particle size 3
500 g can

Product No.: FE-55237655118960
Price on request
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Solder paste ISO-Cream EWL 250g
Content : 250 g / Metal content [%]: 89 % / Grain size: 3 (25-45 µm)
Solder paste ISO-Cream "ELW-2303" Sn95.5Ag4Cu0.5
Lead-free, flux DIN EN 29454, 2.1.3.C
Metal powder content 89%, particle size 3
melting point 217° C eutectic, 250 g can

Product No.: FE-238423038955
Price on request
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