Solder paste ISO-Cream EL3202 500g
The solder paste ISO-Cream EL3202, manufactured by Felder, is a high-quality, lead-free SMD solder paste known for its flexibility and adaptability in technical applications. With a content of 500g and a metal content of 90%, this paste provides optimal performance for precise soldering processes. The particle size of 25-45 µm (particle size 3) and the eutectic melting point of 217°C ensure reliable processing and stable solder joints.
The solder paste can be customized to viscosities ranging from 300 to 900 Pa s (according to Brookfield, 5 rpm, TF spindle, 25 °C) upon customer request, allowing for high adaptability for different application conditions. Compliance with the latest testing and control procedures according to national and international standards ensures consistently high quality across all batches. Ideally suited for precise soldering processes, the ISO-Cream EL3202 provides a reliable solution for your technical requirements.
Details
- Content [g] Content
- 500
- Metal content [%] Metal content [%]
- 90
- Grain size Grain size
- 3 (25-45 µm)
- Melting point Melting point
- 217
No-clean SMD soft solder pastes
| Homogeneous, ready-made and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics. | |
| ISO-Cream® "EL 5510" | No-clean SMD solder paste, best wetting in lead-free applications. Premium contour stability, optimal printability, very high surface resistance. Long processing period of at least 48 hours. Suitable for all reflow applications. (ROL0) |
| ISO-Cream® "Clear" | No-clean SMD solder paste, best wedding on all PCB surfaces especially NiAu and NiPd unter normal conditions. Ptotective atmosphere also in the vapor phase, halogene-fre (<0.01%), rosin-free, clear and unobtrusive residues, low tendency to void generation |
| ISO-Cream® "EL 3202" | No-clean SMD solder paste, best suitability for vapor phase soldering. Particularly suited for the stencil printing. Low water-clear residues. Long processing period of at least 48 hours. (ROL1) |
| ISO-Cream® "EL 3203" | No-clean SMD solder paste with excellent wet bonding strength for automatic placement machines with high acceleration or deceleration. Printed circuit boards up to 32 h can be equipped. High contour stability, high service life on the stencil (up to 8 hours). (ROL1) |
SMD special soft soldering pastes
For soldering of poorly solderable components with downstream cleaning process. Homogeneous, ready to use and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics. | |
| ISO-Cream® "RA 2601" | Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ROM1. Especially for poorly wettable solder partner. The flux residues on the soldered circuits should be removed. |
| ISO-Cream® "ELW 2303" | Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ORM0. Solder paste with water soluble residues. Excellent wetting on all common surfaces. The residues can be completely removed with distilled water. |
| Cans | 250 g und 500 g |
| Cartridges | 6 und 12 oz Semco® |
| Cartridges | ProFlow™ and PuckPack™ |
| Dispenser cartridge | 5, 10 und 30 ccm |
 Alloys | |
| Sn96Ag+® Sn96.5Ag3Cu0.5NiGe | 217 - 219 ºC |
| Sn100Ni+® Sn99.3Cu0.7AgNiGe | 227 ºC eutectic |
| Sn95.5Ag4Cu0.5 | 217 ºC eutectic |
| Sn96.5Ag3.5 | 221 ºC eutectic |
| Bi58Sn42 | 138 ºC eutectic |
| Leaded Alloys | |
| Sn62Pb36Ag2 | 179 ºC eutectic |
| Sn63Pb37 | 183 ºC eutectic |
| Pb93Sn5Ag2 | 296 - 301 ºC |
| Metal proportions | |
| Dispenser application | 85 - 88 % |
| Screen printing | 88 % |
| Stencil printing | 88 - 90 % |
| Grain sizes | ||
| KG 2 | Standard | 45 - 75 µm |
| KG 3 | Fine-Pitch | 25 - 45 µm |
| KG 4 | Superfine-Pitch | 20 - 38 µm |
| KG 5 | Superfine-Pitch | 15 - 25 µm |
Downloads
- Please log in to download datasheets! :
- There are several datasheets for this product. Please log in!
Workwear | Professional Footwear 2024
DPV main catalog 2023 | 2024