Solder paste ISO-Cream EL5510 500g
The solder paste ISO-Cream EL5510 from Felder is a high-quality, lead-free SMD solder paste known for its excellent wetting properties and specifically developed for lead-free applications. This paste is characterized by first-class contour stability and optimal printing properties, making it ideal for precise soldering processes. The paste remains stable over a long processing period of at least 48 hours and is suitable for all reflow applications.
The ISO-Cream EL5510 contains an alloy of Sn96.5Ag3Cu0.5NiGe and has a melting point between 217 °C and 219 °C. It offers very high surface resistance and is especially suitable for stencil printing. With a metal content of 88-89% and a particle size of 25-45 µm (particle size 3), this paste guarantees consistent results during processing.
Felder manufactures the ISO-Cream SMD solder pastes using state-of-the-art testing and control procedures based on national and international standards to ensure 100% continuous, batch-to-batch quality. Customers can also have the viscosity of the paste adjusted between 300 and 900 Pa s to meet specific requirements.
The ISO-Cream EL5510 contains an alloy of Sn96.5Ag3Cu0.5NiGe and has a melting point between 217 °C and 219 °C. It offers very high surface resistance and is especially suitable for stencil printing. With a metal content of 88-89% and a particle size of 25-45 µm (particle size 3), this paste guarantees consistent results during processing.
Felder manufactures the ISO-Cream SMD solder pastes using state-of-the-art testing and control procedures based on national and international standards to ensure 100% continuous, batch-to-batch quality. Customers can also have the viscosity of the paste adjusted between 300 and 900 Pa s to meet specific requirements.
Details
- Content [g] Content
- 500
- Metal content [%] Metal content [%]
- 88 - 89
- Grain size Grain size
- 3 (25-45 µm)
- Melting point Melting point
- 217 - 219
No-clean SMD soft solder pastes
| Homogeneous, ready-made and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics. | |
| ISO-Cream® "EL 5510" | No-clean SMD solder paste, best wetting in lead-free applications. Premium contour stability, optimal printability, very high surface resistance. Long processing period of at least 48 hours. Suitable for all reflow applications. (ROL0) |
| ISO-Cream® "Clear" | No-clean SMD solder paste, best wedding on all PCB surfaces especially NiAu and NiPd unter normal conditions. Ptotective atmosphere also in the vapor phase, halogene-fre (<0.01%), rosin-free, clear and unobtrusive residues, low tendency to void generation |
| ISO-Cream® "EL 3202" | No-clean SMD solder paste, best suitability for vapor phase soldering. Particularly suited for the stencil printing. Low water-clear residues. Long processing period of at least 48 hours. (ROL1) |
| ISO-Cream® "EL 3203" | No-clean SMD solder paste with excellent wet bonding strength for automatic placement machines with high acceleration or deceleration. Printed circuit boards up to 32 h can be equipped. High contour stability, high service life on the stencil (up to 8 hours). (ROL1) |
SMD special soft soldering pastes
For soldering of poorly solderable components with downstream cleaning process. Homogeneous, ready to use and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics. | |
| ISO-Cream® "RA 2601" | Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ROM1. Especially for poorly wettable solder partner. The flux residues on the soldered circuits should be removed. |
| ISO-Cream® "ELW 2303" | Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ORM0. Solder paste with water soluble residues. Excellent wetting on all common surfaces. The residues can be completely removed with distilled water. |
| Cans | 250 g und 500 g |
| Cartridges | 6 und 12 oz Semco® |
| Cartridges | ProFlow™ and PuckPack™ |
| Dispenser cartridge | 5, 10 und 30 ccm |
 Alloys | |
| Sn96Ag+® Sn96.5Ag3Cu0.5NiGe | 217 - 219 ºC |
| Sn100Ni+® Sn99.3Cu0.7AgNiGe | 227 ºC eutectic |
| Sn95.5Ag4Cu0.5 | 217 ºC eutectic |
| Sn96.5Ag3.5 | 221 ºC eutectic |
| Bi58Sn42 | 138 ºC eutectic |
| Leaded Alloys | |
| Sn62Pb36Ag2 | 179 ºC eutectic |
| Sn63Pb37 | 183 ºC eutectic |
| Pb93Sn5Ag2 | 296 - 301 ºC |
| Metal proportions | |
| Dispenser application | 85 - 88 % |
| Screen printing | 88 % |
| Stencil printing | 88 - 90 % |
| Grain sizes | ||
| KG 2 | Standard | 45 - 75 µm |
| KG 3 | Fine-Pitch | 25 - 45 µm |
| KG 4 | Superfine-Pitch | 20 - 38 µm |
| KG 5 | Superfine-Pitch | 15 - 25 µm |
GHS05
Substances and mixtures that have a corrosive, skin-corrosive and/or severely eye-damaging effect on metals (acids, alkalis)
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