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Solder paste ISO-Cream EWL 250g
(Product No.: FE-238423038955)
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Solder paste ISO-Cream EWL 250g

dpvlink:
15327
Content [g]:
250
Metal content [%]:
89
Grain size:
3 (25-45 µm)
Properties:
Further product information
 

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Product Info
The ISO-Cream® EWL 250g solder paste from Felder is a high-quality, lead-free SMD solder paste specifically developed for demanding soldering applications. With a metal content of 89% and a particle size of 25-45 µm (particle size 3), it offers optimal performance for fine solder joints. The paste is characterized by a eutectic melting point of 217 °C, making it ideal for precise soldering processes.
The viscosity of the ISO-Cream® SMD solder pastes can be individually adjusted between 300 and 900 Pa s to meet specific requirements. This is ensured by modern testing and control procedures that provide a 100% quality guarantee across all batches. This solder paste meets national and international standards, highlighting its reliability and consistency.
Content [g]
Content
250
Metal content [%]
Metal content [%]
89
Grain size
Grain size
3 (25-45 µm)
Melting point
Melting point
217
Common
No-clean SMD soft solder pastes

Homogeneous, ready-made and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics.
ISO-Cream® "EL 5510"
No-clean SMD solder paste, best wetting in lead-free applications. Premium contour stability, optimal printability, very high surface resistance. Long processing period of at least 48 hours.
Suitable for all reflow applications. (ROL0)
ISO-Cream® "Clear"
No-clean SMD solder paste, best wedding  on all PCB surfaces especially NiAu and NiPd unter normal conditions. Ptotective atmosphere also in the vapor phase, halogene-fre (<0.01%), rosin-free, clear and unobtrusive residues, low tendency to void generation
ISO-Cream® "EL 3202"
No-clean SMD solder paste, best suitability for vapor phase soldering. Particularly suited for the stencil printing. Low water-clear residues. Long processing period of at least 48 hours. (ROL1)
ISO-Cream® "EL 3203"
No-clean SMD solder paste with excellent wet bonding strength for automatic placement machines with high acceleration or deceleration. Printed circuit boards up to 32 h can be equipped. High contour stability, high service life on the stencil (up to 8 hours). (ROL1)

SMD special soft soldering pastes

For soldering of poorly solderable components with downstream cleaning process. Homogeneous, ready to use and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics.
ISO-Cream® "RA 2601"
Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ROM1. Especially for poorly wettable solder partner. The flux residues on the soldered circuits should be removed.
ISO-Cream®
"ELW 2303"
Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ORM0. Solder paste with water soluble residues. Excellent wetting on all common surfaces. The residues can be completely removed with distilled water.



 Cans 250 g und 500 g
 Cartridges 6 und 12 oz Semco®  
 Cartridges ProFlow™ and PuckPack™
 Dispenser cartridge 5, 10 und 30 ccm



   Alloys
 Sn96Ag+®  Sn96.5Ag3Cu0.5NiGe 217 - 219 ºC
 Sn100Ni+®  Sn99.3Cu0.7AgNiGe 227 ºC eutectic
 Sn95.5Ag4Cu0.5 217 ºC eutectic
 Sn96.5Ag3.5 221 ºC eutectic
 Bi58Sn42 138 ºC eutectic



 Leaded Alloys
 Sn62Pb36Ag2 179 ºC eutectic
 Sn63Pb37 183 ºC eutectic
 Pb93Sn5Ag2 296 - 301 ºC

 Metal proportions
 Dispenser application 85 - 88 %
 Screen printing 88 %
 Stencil printing 88 - 90 %

 Grain sizes
 KG 2 Standard 45 - 75 µm
 KG 3 Fine-Pitch 25 - 45 µm
 KG 4 Superfine-Pitch 20 - 38 µm
 KG 5 Superfine-Pitch 15 - 25 µm


Pictograms
GHS05
Substances and mixtures that have a corrosive, skin-corrosive and/or severely eye-damaging effect on metals (acids, alkalis)

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